Manufacturing method for solder resisting bridge
The invention discloses a manufacturing method for a solder resisting bridge. The manufacturing method comprises the steps of pasting a film on a screen, performing steps of coating light-sensitive coating, exposing and developing in sequence to form baffle points in the position, corresponding a pr...
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| creator | LUO WUCHENG WANG GUO ZENG JIANFENG |
| description | The invention discloses a manufacturing method for a solder resisting bridge. The manufacturing method comprises the steps of pasting a film on a screen, performing steps of coating light-sensitive coating, exposing and developing in sequence to form baffle points in the position, corresponding a production board solder resisting bridge, of the screen so as to form an ink baffling region in the position, corresponding to the solder resisting bridge, on the screen region; setting the screen on the production board, then coating solder resisting light-sensitive ink, enabling the solder resisting light-sensitive ink to be silk screened on the production board through the screen outside the ink baffling region, and based on the fluidity of the solder resisting light-sensitive ink, the solder resisting light-sensitive ink in the positions of IC pins on the production board flowing to the position of the solder resisting bridge; performing exposure by adopting a solder resisting film to enable the solder resisting |
| format | Patent |
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The manufacturing method comprises the steps of pasting a film on a screen, performing steps of coating light-sensitive coating, exposing and developing in sequence to form baffle points in the position, corresponding a production board solder resisting bridge, of the screen so as to form an ink baffling region in the position, corresponding to the solder resisting bridge, on the screen region; setting the screen on the production board, then coating solder resisting light-sensitive ink, enabling the solder resisting light-sensitive ink to be silk screened on the production board through the screen outside the ink baffling region, and based on the fluidity of the solder resisting light-sensitive ink, the solder resisting light-sensitive ink in the positions of IC pins on the production board flowing to the position of the solder resisting bridge; performing exposure by adopting a solder resisting film to enable the solder resisting</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170808&DB=EPODOC&CC=CN&NR=107027245A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170808&DB=EPODOC&CC=CN&NR=107027245A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LUO WUCHENG</creatorcontrib><creatorcontrib>WANG GUO</creatorcontrib><creatorcontrib>ZENG JIANFENG</creatorcontrib><title>Manufacturing method for solder resisting bridge</title><description>The invention discloses a manufacturing method for a solder resisting bridge. 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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Manufacturing method for solder resisting bridge |
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