Manufacturing method for solder resisting bridge

The invention discloses a manufacturing method for a solder resisting bridge. The manufacturing method comprises the steps of pasting a film on a screen, performing steps of coating light-sensitive coating, exposing and developing in sequence to form baffle points in the position, corresponding a production board solder resisting bridge, of the screen so as to form an ink baffling region in the position, corresponding to the solder resisting bridge, on the screen region; setting the screen on the production board, then coating solder resisting light-sensitive ink, enabling the solder resisting light-sensitive ink to be silk screened on the production board through the screen outside the ink baffling region, and based on the fluidity of the solder resisting light-sensitive ink, the solder resisting light-sensitive ink in the positions of IC pins on the production board flowing to the position of the solder resisting bridge; performing exposure by adopting a solder resisting film to enable the solder resisting