Apparatuses and Methods for Encapsulated Devices
One embodiment is directed towards an encapsulated device. The encapsulated device includes a device, and a first encapsulation covering the device. The first encapsulation has one or more exterior surfaces. One or more recesses in one or more of the exterior surfaces is configured to receive a seco...
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| creator | CARPENTER, LOYDE M, JR CRUZ, RANDOLPH KWOKA, MARK A |
| description | One embodiment is directed towards an encapsulated device. The encapsulated device includes a device, and a first encapsulation covering the device. The first encapsulation has one or more exterior surfaces. One or more recesses in one or more of the exterior surfaces is configured to receive a second encapsulation.
个实施方式涉及种封装器件。这种封装器件包含器件和覆盖该器件的第封装件。第封装件具有个或者多个外表面。个或者多个外表面中的个或多个凹槽被配置成接纳第二封装件。 |
| format | Patent |
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个实施方式涉及种封装器件。这种封装器件包含器件和覆盖该器件的第封装件。第封装件具有个或者多个外表面。个或者多个外表面中的个或多个凹槽被配置成接纳第二封装件。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170808&DB=EPODOC&CC=CN&NR=107026130A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170808&DB=EPODOC&CC=CN&NR=107026130A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CARPENTER, LOYDE M, JR</creatorcontrib><creatorcontrib>CRUZ, RANDOLPH</creatorcontrib><creatorcontrib>KWOKA, MARK A</creatorcontrib><title>Apparatuses and Methods for Encapsulated Devices</title><description>One embodiment is directed towards an encapsulated device. The encapsulated device includes a device, and a first encapsulation covering the device. The first encapsulation has one or more exterior surfaces. One or more recesses in one or more of the exterior surfaces is configured to receive a second encapsulation.
个实施方式涉及种封装器件。这种封装器件包含器件和覆盖该器件的第封装件。第封装件具有个或者多个外表面。个或者多个外表面中的个或多个凹槽被配置成接纳第二封装件。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBwLChILEosKS1OLVZIzEtR8E0tychPKVZIyy9ScM1LTiwoLs1JLElNUXBJLctMTi3mYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GBuYGRmaGxgaOxsSoAQBRhCsS</recordid><startdate>20170808</startdate><enddate>20170808</enddate><creator>CARPENTER, LOYDE M, JR</creator><creator>CRUZ, RANDOLPH</creator><creator>KWOKA, MARK A</creator><scope>EVB</scope></search><sort><creationdate>20170808</creationdate><title>Apparatuses and Methods for Encapsulated Devices</title><author>CARPENTER, LOYDE M, JR ; CRUZ, RANDOLPH ; KWOKA, MARK A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN107026130A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CARPENTER, LOYDE M, JR</creatorcontrib><creatorcontrib>CRUZ, RANDOLPH</creatorcontrib><creatorcontrib>KWOKA, MARK A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CARPENTER, LOYDE M, JR</au><au>CRUZ, RANDOLPH</au><au>KWOKA, MARK A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Apparatuses and Methods for Encapsulated Devices</title><date>2017-08-08</date><risdate>2017</risdate><abstract>One embodiment is directed towards an encapsulated device. The encapsulated device includes a device, and a first encapsulation covering the device. The first encapsulation has one or more exterior surfaces. One or more recesses in one or more of the exterior surfaces is configured to receive a second encapsulation.
个实施方式涉及种封装器件。这种封装器件包含器件和覆盖该器件的第封装件。第封装件具有个或者多个外表面。个或者多个外表面中的个或多个凹槽被配置成接纳第二封装件。</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Apparatuses and Methods for Encapsulated Devices |
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