Apparatuses and Methods for Encapsulated Devices

One embodiment is directed towards an encapsulated device. The encapsulated device includes a device, and a first encapsulation covering the device. The first encapsulation has one or more exterior surfaces. One or more recesses in one or more of the exterior surfaces is configured to receive a second encapsulation. 个实施方式涉及种封装器件。这种封装器件包含器件和覆盖该器件的第封装件。第封装件具有个或者多个外表面。个或者多个外表面中的个或多个凹槽被配置成接纳第二封装件。