SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

A manufacturing method of a semiconductor device forms grooves on a surface side of a semiconductor substrate and thereafter performs grinding from a back side of the semiconductor substrate until a ground face reaches the grooves. Thereafter, a back electrode is formed on the back of the semiconductor substrate that is separated by the grinding. 本文公开了种半导体装置及其制造方法。半导体装置的制造方法在半导体衬底的表面侧上形成槽，并且在此之后从半导体衬底的背部侧执行研磨，直到研磨面到达槽。在此之后，在通过研磨被分离的半导体衬底的背部上形成背部电极。