WINDING STRUCTURE OF BONDING WIRE FOR SEMICONDUCTOR DEVICES

The objective of this invention is to provide a novel winding structure of a bonding wire which has stronger tightening force than before and does not collapse due to vibration etc. during transportation. Another object of this invention is to provide a winding structure of a bonding wire capable of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MICHITAKA MIKAMI, WEI CHEN, NANAKO MAEDA, ANNA ITO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES PACKING PERFORMING OPERATIONS SEMICONDUCTOR DEVICES STORING TRANSPORTING
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Beschreibung
Zusammenfassung:	The objective of this invention is to provide a novel winding structure of a bonding wire which has stronger tightening force than before and does not collapse due to vibration etc. during transportation. Another object of this invention is to provide a winding structure of a bonding wire capable of eliminating waste of wires and smoothly performing spool exchanging operation. The winding structure of a bonding wire of this invention is characterized in that the bonding wire is wound on a spool consisting of a sequentially wound front winding portion, a real winding portion wound in cross-multilayered form, and a sequentially wound tail winding portion. A protruding portion of a middle oblique side or an upper oblique side having an elevation angle steeper than an elevation angle of a lower oblique side extended from the end portion of the spool is provided on at least one oblique side formed by two end shape of the real winding portion. The protruding portion is connected with a wave shaped serrated layer; a