Multielement curing agent and application thereof in multielement curing epoxy resin

The invention provides a multielement curing agent, which is prepared by compounding 59 to 99.9 parts by mass of at least one of aldehyde compound and unsaturated functional group compound with the boiling point being above 110 DEG C, 0 to 40 parts by mass of epoxy group reactive diluent and 0.1 to...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAN GUOQUAN, TAN ZHEYUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!