Multielement curing agent and application thereof in multielement curing epoxy resin
The invention provides a multielement curing agent, which is prepared by compounding 59 to 99.9 parts by mass of at least one of aldehyde compound and unsaturated functional group compound with the boiling point being above 110 DEG C, 0 to 40 parts by mass of epoxy group reactive diluent and 0.1 to...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a multielement curing agent, which is prepared by compounding 59 to 99.9 parts by mass of at least one of aldehyde compound and unsaturated functional group compound with the boiling point being above 110 DEG C, 0 to 40 parts by mass of epoxy group reactive diluent and 0.1 to 1.0 part by mass of defoaming agent. The multielement curing agent is applied in multielement curing epoxy resin; without changing a traditional epoxy-terminated functional group reaction curing method, at least one of a reactable aldehyde group functional group and an unsaturated functional group is introduced to be used as a reaction group besides the epoxy group functional group, a condition is provided for reacting and curing, and an epoxy resin cured material is enabled to generate an interpenetrating network structure, so that the heat resistance, the strength, the toughness, the caking property, the ageing resistance and the like of the cured material are improved, in addition, the multielement curing agent |
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