Component handling assembly and method of handling components

A component handling assembly comprising: a carrier comprising a surface configured to support a plurality of components, the surface having a plurality of holes defined therein; a vacuum generator configured to be arranged in communication with the plurality of holes such that a vacuum is applied, through the plurality of holes, to components supported on the surface of the carrier, to hold the components on the surface of the carrier; and a vacuum sensor configured to monitor a level of the vacuum applied to the components supported on the surface of the carrier. 种构件处理组件，包括：载体，其包括构造成支承多个构件的表面，所述表面具有限定于所述表面中的多个孔；真空发生器，其构造成与所述多个孔连通布置，使得真空经由所述多个孔施加到支承在所述载体的表面上的构件，以使构件保持在所述载体的表面上；以及真空传感器，其构造成监测施加到支承在所述载体的表面上的构件的真空水平。