Adhesion head and semiconductor manufacturing apparatus using same

The invention provides a semiconductor manufacturing apparatus that improves the loading precision of a semiconductor device relative to a covering side of a to-be-loaded body and improves the adhesion performance between the covering side of the to-be-loaded body and the semiconductor device, and also provides an adhesion head used for the same. The invention provides an adhesion head which comprises an elastic member in a part where the adhesion head contacts a semiconductor device and an alignment mark recognition area capable of detecting an optically readable marker provided on a surface to be contacted to the semiconductor device. Additionally, a semiconductor manufacturing apparatus in which the adhesion head is applied is provided. 本发明提供种可提高半导体器件相对于被搭载体的接合面的搭载精度、并可提高被搭载体的接合面与半导体器件间的接合性的半导体制造装置及用于该半导体制造装置的接合头。本发明提供种在与半导体器件相接触的部分包括弹性部件、并具有用于能够对以可光学性读取的方式设置在所述半导体器件的被接触面上的标识进行检测的对准标记识别区域的接合头以及采用了该接合头的半导体制造装置。