Frame packaging structure integrating passive device and manufacturing method thereof

The invention discloses a frame packaging structure integrating a passive device and a manufacturing method thereof. The frame packaging structure integrating the passive device comprises a bare chip pad, a first insulation dielectric layer, a metal structure layer, a second insulation dielectric layer and at least one conductive pad, wherein the first insulation dielectric layer is arranged below the bare chip pad; the metal structure layer is arranged below the first insulation dielectric layer; the second insulation dielectric layer is arranged below the metal structure layer; and the at least one conductive pad is arranged at a periphery of the bare chip pad. The at least one conductive pad is connected to the second insulation dielectric layer. At least one active chip is arranged on the bare chip pad. The at least one active chip is electrically connected to the conductive pad. 本发明公开了种集成无源器件的框架封装结构及其制备方法，所述集成无源器件的框架封装结构包括：裸片垫，设置于所述裸片垫下方的第绝缘介质层，设置于所述第绝缘介质层下方的金属结构层，设置于所述金属结构层下方的第二绝缘介质层，以及，设置于所述裸片垫外围的至少个导电