Preparation method of double-face copper pouring ceramic substrate
The invention relates to a preparation method of a double-face copper pouring ceramic substrate. The method comprises the steps that first, a ceramic sheet base material and copper sheets are washed; second, the copper sheets are subjected to annealing treatment in a first protective atmosphere, whe...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a preparation method of a double-face copper pouring ceramic substrate. The method comprises the steps that first, a ceramic sheet base material and copper sheets are washed; second, the copper sheets are subjected to annealing treatment in a first protective atmosphere, wherein the annealing temperature is 500-1060 DEG C, and the annealing treatment time is 1-30 min; third, in a second protective atmosphere, a first copper sheet, a ceramic sheet, a second copper sheet are stacked on a shim in sequence for sintering, wherein the sintering temperature is 1065-1082 DEG C, and the sintering time is 1-100 min; fourth, when the sintering ends, the double-face copper pouring ceramic substrate is obtained. According to the preparation method of the double-face copper pouring ceramic substrate, the ceramic sheet base material and the copper sheets are subjected to the sintering on the shim, wherein the shim does not react with the copper and low damage to the copper, so that the product obsol |
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