Inner surface gold plating method in terahertz corrugated horn electroforming

The invention relates to an inner surface gold plating method in terahertz corrugated horn electroforming. The inner surface gold plating method includes the following steps that firstly, a stacked electroforming core mold with the structure consistent with an inner cavity ribbed groove structure of a terahertz corrugated horn is designed according to the inner cavity ribbed groove structure of the terahertz corrugated horn; secondly, gold plating is conducted on copper rings; thirdly, aluminum rings (4) are assembled on an aluminum stick (1) and are then subjected to gold plating, copper bottom plating is conducted firstly when gold plating is conducted on the aluminum rings (4), then, gold plating is conducted, all the aluminum rings (4) are required to be assembled compactly, gold plating liquid is prevented from immersing ring faces where all the rings make contact, the upper aluminum ring (4) with the ring face subjected to gold plating and the lower aluminum ring (4) with the ring face subjected to gold