Insulating resin sheet and a printed circuit board using the insulating resin sheet

The present invention provides an insulating resin sheet and a printed circuit board using the insulating resin sheet. The printed circuit board according to the embodiment of the present invention includes an insulating resin layer including a first insulating resin and a filler, an adhesive auxili...

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Bibliographische Detailangaben
Hauptverfasser:	HWA-YOUNG LEE, JAE-KUL LEE, HO-HYUNG HAM, SEOL-AH CHONG, OK-SEON YOON
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention provides an insulating resin sheet and a printed circuit board using the insulating resin sheet. The printed circuit board according to the embodiment of the present invention includes an insulating resin layer including a first insulating resin and a filler, an adhesive auxiliary layer laminated on the insulating resin layer and including a second insulating resin containing a photosensitive material; and a circuit pattern bonded to the adhesive auxiliary layer. 本发明提供种绝缘树脂片和使用该绝缘树脂片的印刷电路板，根据本发明的实施例的印刷电路板包括：绝缘树脂层，包括第绝缘树脂和填料；粘合辅助层，层压在绝缘树脂层上并包括含有感光材料的第二绝缘树脂；电路图案，结合到粘合辅助层。