Targeted control of the absorption behavior during laser resealing
A method for manufacturing a micromechanical component including a substrate and a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first c...
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| creator | MAWULI AMETOWOBLA PHILIP KAPPE |
| description | A method for manufacturing a micromechanical component including a substrate and a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, includes in a first task, an access opening connecting the first cavity to surroundings of the component is formed in the substrate or cap, in a second task, the first pressure and/or the first chemical composition is adjusted in the first cavity, in a third task, the access opening is sealed by introducing energy or heat into an absorbing part of the substrate or cap with a laser, the introduction of the energy or heat occurring by adjusting the extension of the absorbing part and adjusting the absorption strength in the absorbing part to minimize stresses occurring in the substrate or cap.
本发明提出种用于制造微机械构件的方法，该微机械构件具有衬底和与衬底连接并且与衬底包围第空穴的罩，其中，在第空穴中存在第压力并且包含具有第化学组分的第气体混合物，其中，-在第方法步骤中，在衬底或在罩中构造连接第空穴与微机械构件周围环境的进 |
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本发明提出种用于制造微机械构件的方法，该微机械构件具有衬底和与衬底连接并且与衬底包围第空穴的罩，其中，在第空穴中存在第压力并且包含具有第化学组分的第气体混合物，其中，-在第方法步骤中，在衬底或在罩中构造连接第空穴与微机械构件周围环境的进</description><language>chi ; eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; GYROSCOPIC INSTRUMENTS ; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT ; MACHINE TOOLS ; MEASURING ; MEASURING DISTANCES, LEVELS OR BEARINGS ; MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; NAVIGATION ; PERFORMING OPERATIONS ; PHOTOGRAMMETRY OR VIDEOGRAMMETRY ; PHYSICS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; SOLDERING OR UNSOLDERING ; SURVEYING ; TESTING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170630&DB=EPODOC&CC=CN&NR=106904569A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170630&DB=EPODOC&CC=CN&NR=106904569A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MAWULI AMETOWOBLA</creatorcontrib><creatorcontrib>PHILIP KAPPE</creatorcontrib><title>Targeted control of the absorption behavior during laser resealing</title><description>A method for manufacturing a micromechanical component including a substrate and a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, includes in a first task, an access opening connecting the first cavity to surroundings of the component is formed in the substrate or cap, in a second task, the first pressure and/or the first chemical composition is adjusted in the first cavity, in a third task, the access opening is sealed by introducing energy or heat into an absorbing part of the substrate or cap with a laser, the introduction of the energy or heat occurring by adjusting the extension of the absorbing part and adjusting the absorption strength in the absorbing part to minimize stresses occurring in the substrate or cap.
本发明提出种用于制造微机械构件的方法，该微机械构件具有衬底和与衬底连接并且与衬底包围第空穴的罩，其中，在第空穴中存在第压力并且包含具有第化学组分的第气体混合物，其中，-在第方法步骤中，在衬底或在罩中构造连接第空穴与微机械构件周围环境的进</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>GYROSCOPIC INSTRUMENTS</subject><subject>INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT</subject><subject>MACHINE TOOLS</subject><subject>MEASURING</subject><subject>MEASURING DISTANCES, LEVELS OR BEARINGS</subject><subject>MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>NAVIGATION</subject><subject>PERFORMING OPERATIONS</subject><subject>PHOTOGRAMMETRY OR VIDEOGRAMMETRY</subject><subject>PHYSICS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>SURVEYING</subject><subject>TESTING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAKSSxKTy1JTVFIzs8rKcrPUchPUyjJSFVITCrOLyooyczPU0hKzUgsy8wvUkgpLcrMS1fISSxOLVIoSi1OTcwB8nkYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSbyzn6GBmaWBiamZpaMxMWoAYmsyaw</recordid><startdate>20170630</startdate><enddate>20170630</enddate><creator>MAWULI AMETOWOBLA</creator><creator>PHILIP KAPPE</creator><scope>EVB</scope></search><sort><creationdate>20170630</creationdate><title>Targeted control of the absorption behavior during laser resealing</title><author>MAWULI AMETOWOBLA ; PHILIP KAPPE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN106904569A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>GYROSCOPIC INSTRUMENTS</topic><topic>INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT</topic><topic>MACHINE TOOLS</topic><topic>MEASURING</topic><topic>MEASURING DISTANCES, LEVELS OR BEARINGS</topic><topic>MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>NAVIGATION</topic><topic>PERFORMING OPERATIONS</topic><topic>PHOTOGRAMMETRY OR VIDEOGRAMMETRY</topic><topic>PHYSICS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>SURVEYING</topic><topic>TESTING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>MAWULI AMETOWOBLA</creatorcontrib><creatorcontrib>PHILIP KAPPE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MAWULI AMETOWOBLA</au><au>PHILIP KAPPE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Targeted control of the absorption behavior during laser resealing</title><date>2017-06-30</date><risdate>2017</risdate><abstract>A method for manufacturing a micromechanical component including a substrate and a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, includes in a first task, an access opening connecting the first cavity to surroundings of the component is formed in the substrate or cap, in a second task, the first pressure and/or the first chemical composition is adjusted in the first cavity, in a third task, the access opening is sealed by introducing energy or heat into an absorbing part of the substrate or cap with a laser, the introduction of the energy or heat occurring by adjusting the extension of the absorbing part and adjusting the absorption strength in the absorbing part to minimize stresses occurring in the substrate or cap.
本发明提出种用于制造微机械构件的方法，该微机械构件具有衬底和与衬底连接并且与衬底包围第空穴的罩，其中，在第空穴中存在第压力并且包含具有第化学组分的第气体混合物，其中，-在第方法步骤中，在衬底或在罩中构造连接第空穴与微机械构件周围环境的进</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN106904569A |
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| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GYROSCOPIC INSTRUMENTS INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT MACHINE TOOLS MEASURING MEASURING DISTANCES, LEVELS OR BEARINGS MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK METAL-WORKING NOT OTHERWISE PROVIDED FOR MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY NAVIGATION PERFORMING OPERATIONS PHOTOGRAMMETRY OR VIDEOGRAMMETRY PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SOLDERING OR UNSOLDERING SURVEYING TESTING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Targeted control of the absorption behavior during laser resealing |
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