Targeted control of the absorption behavior during laser resealing

A method for manufacturing a micromechanical component including a substrate and a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, includes in a first task, an access opening connecting the first cavity to surroundings of the component is formed in the substrate or cap, in a second task, the first pressure and/or the first chemical composition is adjusted in the first cavity, in a third task, the access opening is sealed by introducing energy or heat into an absorbing part of the substrate or cap with a laser, the introduction of the energy or heat occurring by adjusting the extension of the absorbing part and adjusting the absorption strength in the absorbing part to minimize stresses occurring in the substrate or cap. 本发明提出种用于制造微机械构件的方法，该微机械构件具有衬底和与衬底连接并且与衬底包围第空穴的罩，其中，在第空穴中存在第压力并且包含具有第化学组分的第气体混合物，其中，-在第方法步骤中，在衬底或在罩中构造连接第空穴与微机械构件周围环境的进