Printed circuit board with hot pipe heat dissipation structure and manufacturing method of printed circuit board

The invention discloses a printed circuit board with a hot pipe heat dissipation structure. The printed circuit board comprises a multi-layer printed circuit substrate and a hot pipe module, wherein the hot pipe module is embedded onto the printed circuit substrate and comprises a heat sink, a hot d...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XIE PEIDA, LI YONG, HUANG GUANGWEN, HE BOLIN, ZHOU WENJIE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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