Printed circuit board with hot pipe heat dissipation structure and manufacturing method of printed circuit board

The invention discloses a printed circuit board with a hot pipe heat dissipation structure. The printed circuit board comprises a multi-layer printed circuit substrate and a hot pipe module, wherein the hot pipe module is embedded onto the printed circuit substrate and comprises a heat sink, a hot disc and a hot pipe, a liquid absorption core is arranged in the hot pipe, and a condensation segment and an evaporation segment of the hot pipe are respectively connected with the heat sink and the hot disc. The invention also discloses a manufacturing method for the printed circuit board with the hot pipe heat dissipation structure. The printed circuit board has the advantages of simple structure, light weight, obvious heat dissipation effect and high stability, external driving is not needed for heat transfer, particularly, and the printed circuit board has excellent heat dissipation effect with regard to the problem of heat dissipation of a CPU with relatively high heat flux density and has positive significance