SOI lateral high voltage device and manufacturing method thereof
The invention provides an SOI lateral high voltage device and a manufacturing method thereof. The manufacturing method comprises the following steps: by taking an SOI (silicon on insulator) as a substrate, forming an N type linear varied doped SOI layer and a thin silicon layer drift region, forming...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides an SOI lateral high voltage device and a manufacturing method thereof. The manufacturing method comprises the following steps: by taking an SOI (silicon on insulator) as a substrate, forming an N type linear varied doped SOI layer and a thin silicon layer drift region, forming a thin silicon layer, namely a thick medium layer, and forming a Pwell region; forming an Nwell region, forming a gate oxidation layer, forming a polycrystalline silicon gate electrode, forming an N strip, forming a P strip, carrying out injection on a first P type heavily doped region, a first N type heavily doped region and a second N type heavily doped region, forming ohmic contact, leading out a contact hole of a first layer of an electrode, etching, depositing aluminum metal, and forming a source contact electrode and a drain contact electrode. The manufacturing method provided by the invention is good in compatibility with the traditional technology and has universality, and device area and device cost of a |
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