Light-cured addition type organopolysiloxane composition and application in LED component packaging

The invention provides a light-cured addition type organopolysiloxane composition, which comprises the following ingredients (by weight): 80-90 parts of alkenyl netted or chain polysiloxane, 8-19.5 parts of polysiloxane containing a silicon-hydrogen bond, 2-60 ppm parts of an UV photo-initiation catalyst, 0.5-2 parts of a photo-initiation aid, and 2-50 ppm parts of a polymerization inhibitor. According to the invention, a siloxane material is cured by a room-temperature photocuring mode. In comparison with the prior art, long-time high-temperature heating is not required in the invention. Therefore, defects of long heating time and long total reaction time of a traditional material preparation method are eliminated. In addition, the product is applicable to a low-temperature thermolabile substrate. Thus, reaction time is saved, reaction rate is increased, and damage to a thermolabile substrate is reduced. 本发明提供了种光固化加成型聚硅氧烷组合物，包括如下含重量份数计的组分：含烯基网状或链状聚硅氧烷 80~90份；含硅氢键的聚硅氧烷 8~19.5份；UV光引发催化剂 2~60 ppm份；光引发助剂 0.5~2份；