Three-dimensional hard and brittle material locating method in multiaxial motion laser system and machining system
The invention provides a three-dimensional hard and brittle material locating method in a multiaxial motion laser system and a machining system, and relates to the field of laser machining. The three-dimensional hard and brittle material locating method in the multiaxial motion laser system comprise...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a three-dimensional hard and brittle material locating method in a multiaxial motion laser system and a machining system, and relates to the field of laser machining. The three-dimensional hard and brittle material locating method in the multiaxial motion laser system comprises the following steps: a part of structure, which shall be moved to a part of an ideal cutting wire, in the multiaxial motion laser system is reflected on a focus of normal incidence laser of an intersection area, wherein the part of the ideal cutting wire is a cutting path of each position; a material in the whole thickness is protruded out on a beam of a midmost concentration area span of an incoming laser beam, and then a part moving due to motion superposition passes a peripheral cutting wire once; and a focus area span in the incoming laser beam only has a part of the thickness of an active part, and consecutive passes between the peripheral cutting wire and an indexing predetermined altitude are subjected to |
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