Vacuum-enhanced heat spreader

Embodiments described in this disclosure include a heat spreader. The heat spreader may include a first layer having a thickness less than about 300 microns; a plurality of pillars disposed on the first layer and arrayed in a pattern, wherein each of the plurality of pillars have a height of less th...

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Bibliographische Detailangaben
Hauptverfasser: LEWIS RYAN JOHN, YANG RONGGUI, LEE YUNGNG, COLLIDGE COLLIN JENNINGS, LIEW LI-ANNE, XU SHANSHAN, LIN CHING-YI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:Embodiments described in this disclosure include a heat spreader. The heat spreader may include a first layer having a thickness less than about 300 microns; a plurality of pillars disposed on the first layer and arrayed in a pattern, wherein each of the plurality of pillars have a height of less than 100 microns; a second layer having a thickness of less than 200 microns, wherein a portion of the first layer and a portion of the second layer are sealed together; and a vacuum chamber formed between the first layer and the second layer and within which the plurality of pillars are disposed. 本申请的实施例中包括种散热器,可包括具有小于300微米厚度的第层;多个安置在所述第层和以种模式排列的柱状物;其中所述多个柱状物的每个柱状物具有小于100微米的高度;具有小于200微米厚度的第二层,其中所述第层的部分与所述第二层的部分密封在起;以及真空室,所述真空室形成在所述第层与所述第二层之间,并且所述真空室内安置多个柱状物。