Mechanically connected semiconductor laser device stack array

The invention provides a mechanically connected semiconductor laser device stack array which consists of multiple semiconductor laser device units, wherein the semiconductor laser device units are provided with recess parts and groove parts; the recess parts are matched with the groove parts, so tha...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHI ZHONG'EN, LIU XINGSHENG, HOU DONG, LIANG XUEJIE, WANG JINGWEI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a mechanically connected semiconductor laser device stack array which consists of multiple semiconductor laser device units, wherein the semiconductor laser device units are provided with recess parts and groove parts; the recess parts are matched with the groove parts, so that the recess parts and the groove parts of every two adjacent semiconductor laser device units are connected in a plugging manner to form a stack array structure. According to the mechanically connected semiconductor laser device stack array, the semiconductor laser device units are assembled in an interference fit plugging manner, so that lossless removal of the semiconductor laser device units can be realized; furthermore, a relatively small size can be also realized, and heat dissipation of a product is facilitated. 本发明提供了种机械连接型的半导体激光器叠阵,由多个半导体激光器单元构成,所述半导体激光器单元设置有凸起部和凹槽部,且凸起部与凹槽部相互匹配,使得相邻的半导体激光器单元的凸起部和凹槽部以插接方式连接形成叠阵结构。本发明的半导体激光器单元采用过盈配合的插接方式进行组装,不但可以实现半导体激光器单元的无损拆装,并且可实现较小的体积,利于产品散热。