Lining grounding component, reaction cavity and semiconductor processing equipment

The invention provides a lining grounding component, a reaction cavity and semiconductor processing equipment, which are used for carrying out electricity conduction and thermal transmission between a lining and a grounded cavity bottom wall. A grounding component and a heat-conducting plate are included. The heat-conducting plate is arranged between the lining and the cavity bottom wall and is contacted with the lining and the cavity bottom wall. The grounding component is nested in the heat-conducting plate and is electrically connected to the lining and the cavity bottom wall. The heat-conducting plate is provided with a concave portion. And the grounding component is correspondingly provided with a convex portion. The convex portion and the concave portion are contacted so as to realize electrical conduction of the heat-conducting plate and the grounding component. By using the lining grounding component, a grounding conduction path of the lining can be increased and a conduction cross section is enlarged