Method for testing mechanical parameters of soldering seam of soldering joint

The invention discloses a method for testing mechanical parameters of a soldering seam of a soldering joint, and belongs to the technical field of soldering manufacturing technologies. The method comprises the following steps of (1) preparing a soldering bar (3); (2) preparing a homogenizing bar (4)...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LUO YUN, ZHANG YUCAI, JIANG WENCHUN, WANG ZHENBO, ZHANG WEIYA, TAN JUNI, TU SHANDONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
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