Method for testing mechanical parameters of soldering seam of soldering joint
The invention discloses a method for testing mechanical parameters of a soldering seam of a soldering joint, and belongs to the technical field of soldering manufacturing technologies. The method comprises the following steps of (1) preparing a soldering bar (3); (2) preparing a homogenizing bar (4)...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a method for testing mechanical parameters of a soldering seam of a soldering joint, and belongs to the technical field of soldering manufacturing technologies. The method comprises the following steps of (1) preparing a soldering bar (3); (2) preparing a homogenizing bar (4) and making the shape and size of the homogenizing bar (4) same as those of the soldering bar (3); (3) carrying out a tensile test on the soldering bar (3) and the homogenizing bar (4); (4) computing the elasticity modulus of a base metal of the homogenizing bar (4); and (5) computing the elasticity modulus of the soldering seam (2) and drawing an enhancement curve of the soldering seam (2). According to the method for testing the mechanical parameters of the soldering seam of the soldering joint, the mechanical properties of a soldering seam area of the soldering joint can be accurately determined and can be obtained through a conventional mechanical tensile test. Compared with a method for testing the mechanical |
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