Wire-cutting method of crystalline silicon
The invention relates to a wire-cutting method of crystalline silicon. The wire-cutting method adopts online mortar and a structure wire for cutting, cutting speed and cutting efficiency are improved effectively, yield is increased, cost of auxiliary materials like mortar is lowered, and slice profi...
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| Hauptverfasser: | , , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention relates to a wire-cutting method of crystalline silicon. The wire-cutting method adopts online mortar and a structure wire for cutting, cutting speed and cutting efficiency are improved effectively, yield is increased, cost of auxiliary materials like mortar is lowered, and slice profitability is improved.
本发明涉及种晶体硅的线切割的方法。所述方法采用在线砂浆和结构线进行切割，有效提高切割速度和切割效率，提高成品率，降低砂浆等辅料成本，改善切片盈利能力。 |
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