Mulch covering planting slip-skin kumquat method

The invention relates to a mulch covering planting slip-skin kumquat method, the kumquat seedling is fertilized after being planted; the radius of the seedling within 0.5 m is covered with mulch which is pressed with the thin soil, after 8 months the mulch is removed. The mulch guards against weeds and anthracnose, after 8 months the seedlings grow into the nursery stocks, the nursery stocks grow more freely after the mulch is removed, at this time the weeds cannot affect the growth of the nursery stocks. 本发明涉及种地膜覆盖种植滑皮金桔的方法，滑皮金桔果苗种植后进行施肥松土后，在果苗周围半径0.5m范围内用地膜覆盖，覆盖后用薄土压膜，8个月后拿掉地膜。覆膜能够防杂草、防炭疽病，8个月后果苗长成苗木，拿掉地膜苗木更自由的生长，这时候杂草已经不能对苗木生长产生影响。