Covering for a component and method for producing a covering for a component

The invention relates to a covering (1) for an electronic component (e.g. of the MEMS, BAW or SAW type). The covering comprises at least one layer (5, 6, 7) having a structure (19, 20, 21) provided with a number of prominences (8, 9, 15) and/or depressions (10, 11, 16). The invention further relates...

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Bibliographische Detailangaben
1. Verfasser:	SCHAUFELE ANSGAR
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention relates to a covering (1) for an electronic component (e.g. of the MEMS, BAW or SAW type). The covering comprises at least one layer (5, 6, 7) having a structure (19, 20, 21) provided with a number of prominences (8, 9, 15) and/or depressions (10, 11, 16). The invention further relates to a method for producing a covering (1) of this type. 说明了种用于电子器件(例如MEMS、BAW或SAW类型)的覆盖物。所述覆盖物包括至少个层(5、6、7)，所述层具有带多个凸部(8、9、15)和/或凹部(10、11、16)的结构化部分(19、20、21)。此外，还提出用于制造这种覆盖物(1)的方法。