Modularized photodiode packaging device

The invention discloses a modularized photodiode packaging device, and belongs to the diode packaging technical field; a ceramic substrate is provided with a through hole filled with a non-luminance diode crystal grain, and epoxy resin is filled between the substrate and the crystal grain; the botto...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUANG ZHENGXIN, WANG GUOQING, CHU HONGSHEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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