Modularized photodiode packaging device

The invention discloses a modularized photodiode packaging device, and belongs to the diode packaging technical field; a ceramic substrate is provided with a through hole filled with a non-luminance diode crystal grain, and epoxy resin is filled between the substrate and the crystal grain; the bottom surface of the ceramic substrate is provided with two conductor layers; the top surface of the ceramic substrate is provided with two conductor layers; an LED upside-down mounting diode crystal grain is arranged above the two conductor layers on the top surface of the ceramic substrate, and two electrodes are respectively connected with the two conductor layers; the crystal grain is wrapped and packaged by silica gel above the ceramic substrate, and a circuit is connected; end electrodes are arranged on two side faces of the ceramic substrates, and connected with the upper and lower conductor layers; the end electrodes and the lower conductor layer are provided with an easy solderability metal layer. The modulari