Novel multilayer chip inductance inside coil and manufacturing method

The invention discloses a novel multilayer chip inductance inside coil and a manufacturing method, and belongs to the technical field of inductance coils. The novel multilayer chip inductance inside coil comprises an inductor lower cover, an inductor upper cover, magnetic bodies, conductors and weld...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ZHAN QIANBIN, ZHAN LI
Format: Patent
Sprache:chi ; eng
Schlagworte:
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