Novel multilayer chip inductance inside coil and manufacturing method

The invention discloses a novel multilayer chip inductance inside coil and a manufacturing method, and belongs to the technical field of inductance coils. The novel multilayer chip inductance inside coil comprises an inductor lower cover, an inductor upper cover, magnetic bodies, conductors and welding tips, wherein the welding tips are fixedly welded at two ends of the inductance inside coil, the inductor upper cover is fixedly arranged at the uppermost end of the inductance inside coil, the inductor lower cover is fixedly arranged a the lowermost end of the inductance inside coil, the conductors are fixedly printed on the inductor lower cover, the magnetic bodies are fixedly printed at the upper ends of the conductors, and the conductors and the magnetic bodies are alternately stacked. The magnetic bodies and the conductors arranged inside the novel multilayer chip inductance inside coil are crossly printed, layers of the inside coil are reliably connected without via holes, the novel multilayer chip induct