Device and method for eliminating surface damage of silicon wafer through acid etching

The invention discloses a device and a method for eliminating surface damage of a silicon wafer through acid etching. The device comprises a carrier, a manipulator, an etching process tank and an acid mixing tank, wherein the carrier comprises two side plates and fixing rods fixedly supported between the two side plates; a carrier center driving shaft, a carrier center driving gear and a carrier driving gear are mounted on each of the two side plates; carrier fixing sleeves are mounted on the carrier center driving shafts; three toothed rotating rods are further mounted between the two side plates; toothed rotating rod transmission gears matched with the carrier center driving gears are arranged at the two ends of each toothed rotating rod; the manipulator comprises carrier locking parts locked with the fixing sleeves on the two sides of the carrier, and further comprises a mechanical arm transmission gear set, a carrier driving motor and two carrier transmission gear sets; the bottom of the etching process t