Uniformly-packaged LED support and LED light source thereof
The invention relates to a uniformly-packaged LED support and an LED light source thereof. The uniformly-package LED support comprises a single support, wherein each single support comprises a support body, a first bonding pad region and a second bonding pad region, the first bonding pad region and...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a uniformly-packaged LED support and an LED light source thereof. The uniformly-package LED support comprises a single support, wherein each single support comprises a support body, a first bonding pad region and a second bonding pad region, the first bonding pad region and the second bonding pad region are arranged on the support body and are isolated with each other, bonding pads are arranged in each of the first bonding pad region and the second bonding pad region and are used for arranging a lamp wick, the areas of the first bonding pad region and the second bonding region are equal or the area of the first bonding pad region occupies 30-70% of the area of the single support, chips in different numbers are arranged in the support, different voltages are input to form the LED light source, and the application demands of different environments can be satisfied. Compared with the prior art, a support unit fully utilizes the space in each support body, the first bonding pad region and |
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