Method for preparing metallized-surface sheet material with high permittivity

The invention discloses a method for preparing a metallized-surface sheet material with high permittivity and relates to substrate materials for printed circuit boards. The method comprises the steps: shearing organic fabrics into strips, then, placing the organic fabric strips in slurry of rutile-phase titanium dioxide granules, and carrying out three-dimensional interpenetrated bonding; preparing an enanthic acid solution, and dissolving a couplant in the enanthic acid solution, so as to obtain a solution A; soaking the three-dimensional interpenetrated bonded organic fabrics in the solution A, and carrying out drying, so as to obtain dried organic fabrics; mixing rutile-phase titanium dioxide granules or rutile-phase titanium dioxide fibers with a C, H and O containing cyclic organic matter, carrying out vacuumizing so as to obtain size mixture, then, soaking the dried organic fabrics in the size mixture, carrying out spatial interpenetrated bonding, and carrying out baking, so as to obtain a prepreg; and