Apparatus and method of processing semiconductor substrate

An apparatus of processing a semiconductor substrate include a chuck, a holder, a liquid supplying system and a positive pressure unit. The chuck has a principal surface and at least a hole formed thereon. The holder is capable of holding a semiconductor substrate at a position above the principal surface. The liquid supplying system is configured to provide a liquid film onto the principal surface through the hole. The positive pressure unit is configured for providing a gas flow to a space over the chuck. A method of processing a semiconductor substrate is disclosed herein as well. 本发明的实施例提供了处理半导体衬底的设备，包括卡盘、夹持器、液体供给系统以及正压单元。卡盘具有主面和在卡盘上形成的至少个孔。夹持器能够将半导体衬底保持在主面上面的位置处。液体供给系统配置为通过孔将液体膜提供至主面上。正压单元配置为将气流提供至卡盘上方的空间。本文还公开了处理半导体衬底的方法。