Electronic device with plated electrical contact

An electronic device includes an electronic component configured to receive electric current and a plated contact electrically coupled to the electronic component and configured to carry the electric current to the electronic component from a system external to the device. The plated contact include...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TOM DENNIS, FISCHER ANTHONY ALLEN, MASTER RAJ, MCCORMACK MARK THOMAS, SHARIFF FARAH, ALAM ZULFIQAR
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CURRENT COLLECTORS ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LINE CONNECTORS METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	An electronic device includes an electronic component configured to receive electric current and a plated contact electrically coupled to the electronic component and configured to carry the electric current to the electronic component from a system external to the device. The plated contact includes a copper-alloy layer, a platinum-group metal (PGM) layer plated over the copper-alloy layer, and a gold-alloy layer plated over the PGM layer. 包括电子组件和经镀覆的接触的电子设备，该电子组件配置用于接收电流，该经镀覆的接触电耦合到该电子组件并被配置来将电流从在该设备外部的系统载入到该电子组件。经镀覆的接触包括铜合金层、镀覆在该铜合金层之上的铂族金属(PGM)层以及镀覆在该PGM层之上的金合金层。