A process for physical vapor deposition of a material layer on surfaces of a plurality of substrates

The present invention relates to a process of physical vapor deposition of a material layer on surfaces of a plurality of substrates (11), wherein: the plurality of substrates (11) are arranged on a dome (12) which rotates according to a dome rotation axis (300); the material to be deposited is vacuum evaporated thanks to an energy beam from a target (13); the energy beam interacts with a beam impact surface of the target chosen within the list consisting of a part of a main surface (15) and a part of an edge (14) of the target and wherein the material diffuses from the target to the substrates around a main diffusion axis (100) which intersects the dome (12) at an intersection point, I; and the angle [Alpha] between the dome rotation axis (300) and the main diffusion axis (100) is chosen within the ranges of +5 DEG to +40 DEG or -5 DEG to -40 DEG. 本发明涉及种在多个基底(11)的表面上物理气相沉积材料层的方法，其中：-该多个基底(11)被安排在根据圆顶旋转轴线(300)旋转的圆顶(12)上；-该待沉积的材料由于能量束从靶材(13)进行真空蒸发；-该能量束与在由该靶材的主表面(15)的部分和边缘(14)的部分组成的列表中选择的该靶材的光束冲击表面相互作用，并且其中该材料