Solder paste

The invention relates to a solder paste containing or consisting of (i) 10-30 wt.% of at least one type of particles each having a phosphorous content of > 0 to =< 500 wt. ppm and being selected from the group consisting of copper particles, copper-rich copper/zinc alloy particles and copper-r...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FRITZSCHE SEBASTIAN, SCHULZE JURGEN, TRODLER JORG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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