Solder paste

The invention relates to a solder paste containing or consisting of (i) 10-30 wt.% of at least one type of particles each having a phosphorous content of > 0 to =< 500 wt. ppm and being selected from the group consisting of copper particles, copper-rich copper/zinc alloy particles and copper-rich copper/tin alloy particles, (ii) 60-80 wt.% of at least one type of particles selected from the group consisting of tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles and tin-rich tin/copper/silver alloy particles, and (iii) 3-30 wt.% of flux, the average particle diameter of metallic particles (i) and (ii) being =< 15 [mu]m. 焊膏，其含有(i)10-30重量%的各自具有>0至≤500重量ppm的磷含量并选自铜粒子、富铜的铜/锌合金粒子和富铜的铜/锡合金粒子的至少种类型的粒子，(ii)60-80重量%的选自锡粒子、富锡的锡/铜合金粒子、富锡的锡/银合金粒子和富锡的锡/铜/银合金粒子的至少种类型的粒子，和(iii)3-30重量%的助焊剂或由(i)、(ii)和(iii)构成，其中金属粒子(i)和(ii)的平均粒径≤15微米。