Surface treatment method of titanium alloy material

The invention discloses a surface treatment method of a titanium alloy material. The surface treatment method comprises the following steps of grinding, polishing, unoiling, degreasing and cleaning a titanium alloy; putting the obtained titanium alloy into a micro-arc oxidation electrolyte for carry...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	DIAO ZHANGZHANG, WEN SHIFENG, CHEN XIA, FENG TAO, YUAN XIN, CHEN GUANGMENG, XIAN ZHENHUA, LIU XIANGLEI, LIU ZIQIANG, YUE ZHUFENG, ZHOU SIBO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention discloses a surface treatment method of a titanium alloy material. The surface treatment method comprises the following steps of grinding, polishing, unoiling, degreasing and cleaning a titanium alloy; putting the obtained titanium alloy into a micro-arc oxidation electrolyte for carrying out micro-arc oxidation treatment on the obtained titanium alloy; putting the obtained titanium alloy in an ion plating vacuum chamber for cleaning the obtained titanium alloy; putting the obtained titanium alloy in a film plating chamber, and carrying out ion aluminum plating treatment for film plating for 10min to 60min at 100 to 350 DEG C by adopting pure aluminum as a target material, wherein, after the argon ion bombardment is finished, the bias of a substrate is regulated to be 350V to 600V, the duty ratio of the bias is 65 percent, and a target current is 60A to 100A; and carrying out hole sealing on the obtained titanium alloy by adopting an epoxy resin solution in which aminopropyltriethoxysilane is us