Fingerprint sensing device and method for producing the same

A fingerprint sensing device includes an insulating package, an image-sensing die, a light-emitting element, and a conductive component. The insulating package has a bottom surface and a top surface formed with first and second recesses. The image-sensing die is disposed in the first recess and has an outer surface exposed therefrom. The light-emitting element is disposed in the second recess and has an outer surface exposed from the second recess, and an electrode unit. The conductive component is formed in the insulating package, has top and bottom ends exposed from the top and bottom surfaces of the insulating package, and is electrically coupled to the image-sensing die and the electrode unit. 种指纹感测装置，包含绝缘封装体、影像感测芯片、发光元件，及导电组件，绝缘封装体包括正面及背面，绝缘封装体的正面朝背面方向凹陷形成第凹槽及第二凹槽，影像感测芯片设置于第凹槽内并包括经第凹槽显露于正面的芯片表面，芯片表面包含感测部及导接部，发光元件设置于第二凹槽内并包括经第二凹槽显露于正面的外表面，及设置于外表面的电极单元，导电组件形成于绝缘封装体内，导电组件两相反端分别显露出正面及背面，导电组件分别与影像感测芯片的导接部及发光元件的电极单元电连接。绝缘封装体会同时包覆住影像感测芯片及发光元件，使封装后的整体体积能缩小且厚度能变薄，以达到小型化及薄型化的功效。