Method for producing electronic component, and electronic assembly, heating device being provided in the substrate of the assembly

The invention relates to a method for producing an electronic assembly or for disassembling same. The invention additionally relates to the electronic assembly. The assembly has a heating device (16) which is integrated into a substrate (11). The heating device can be heated via an external power supply (19) during the assembly process so that for example solder connections (25) of an electric component (23) can be melted. According to the invention, the heating device (16) can also be used when operating the electronic assembly, said heating device then being directly actuated by the component (23). For this purpose, an electric connection must then be established between the component (23) and the heating device (16), said connection not yet being provided during the thermal assembly process in order to protect the electronic components (23) of the circuit from being damaged. 本发明涉及种用于制造电子组件或者用于拆卸电子组件的方法。本发明还涉及种电子组件。组件具有集成在基板(11)中的加热装置(16)。在安装处理期间可以经由外部的电力供应(19)对其进行加热，由此例如可以使电部件(23)的焊接连接(25)融化。根据本发明设置为，加热装置(