Cooling module and electronic device

The cooling module comprises a heat sink for cooling a power component of an ultrasonic source and a resonance tube arranged between the ultrasonic source and the heat sink and designed to guide the stream of air flowing through the resonance tube, inter alia, in a circumferential preferred directio...

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Bibliographische Detailangaben
Hauptverfasser:	MOCK RANDOLF, LOSCHKE JAKOB
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	The cooling module comprises a heat sink for cooling a power component of an ultrasonic source and a resonance tube arranged between the ultrasonic source and the heat sink and designed to guide the stream of air flowing through the resonance tube, inter alia, in a circumferential preferred direction. The electronic device comprises a power component and a heat sink provided for cooling, the heat sink of the cooling module being designed and arranged for cooling the power component. 冷却模块包括用于冷却超声源的功率部件的散热器和共振管，所述共振管布置在超声源和散热器之间并且被设计成尤其在周向优选方向上引导流过共振管的空气流。电子设备包括功率部件和设置用于冷却的散热器，冷却模块的散热器被设计和布置成用于冷却功率部件。