Machining method for soldering micro-strip boards by using printing solder paste

The invention relates to a machining method for soldering micro-strip boards by using printing solder paste. The machining method comprises the following operation steps: (1) the micro-strip boards and substrates are cleaned; (2) four or more cleaned substrates are respectively placed in positioning grooves of positioning baseplates; (3) net plates are placed on the four or more substrates; and mesh units uniformly distributed on the net plates are respectively corresponding to the four or more substrates; (4) the net plates are uniformly coated with the printing solder paste; and (5) the net plates are taken down; the corresponding micro-strip boards are placed on the uniformly deposited solder paste; and each micro-strip board is corresponding to one substrate to form a welding module. The conventional steps of pressing block fixation, welding, pressing block disassembly, cleaning and detection are performed; reflow soldering is adopted; and the reflow soldering is performed by four temperature phases. The