Photolithography mask for manufacturing gold-plated copper strip micro-connection lines employing chemical milling process

The invention discloses a photolithography mask for manufacturing gold-plated copper strip micro-connection lines employing a chemical milling process. A layout structure of the mask comprises a square frame and two diagonal beams, wherein the two diagonal beams are formed by connecting four vertexes of the square frame two by two; the square frame is equally divided into four effective graphic areas in an isosceles right-angled triangle form by the two diagonal beams; a micro-connection line graphic is arranged in each effective graphic area and comprises a plurality of micro-connection lines which are equal in width and parallel to one another and are arranged at equal intervals; the micro-connection lines are vertical to the bevel edges of the corresponding effective graphic areas; and one end of each micro-connection line is located on the bevel edge of the corresponding effective graphic area and the other end is located on one right-angle side of the corresponding effective graphic area. The layout mode