An organic/inorganic composite adhesive used for a high-thermal-conductivity mica tape and a preparing method thereof

The invention relates to an organic/inorganic composite adhesive used for a high-thermal-conductivity mica tape and a preparing method thereof. The adhesive comprises 5-15% of organic/inorganic silicone-epoxy resin, 20-30% of acetone and 65-70% of toluene, with the mass of the adhesive being 100%. The mica tape prepared by utilizing the adhesive has a high heat conductivity coefficient. In addition, the adhesive has a high molecular weight, shows good cementability, has high viscosity at room temperature and has low viscosity at high temperature. The adhesive has good compatibility with VPI impregnated resin, thus meeting requirements of practical application. The preparing method is simple and raw materials are cheap. 本发明涉及种高导热云母带用有机/无机复合胶粘剂及其制备方法，按所述的胶黏剂的质量为100%计，其由以下组分组成：有机/无机复合有机硅-环氧树脂5~15%；丙酮20~30%；甲苯65~70%。本发明所得的高导热云母带用有机/无机复合胶粘剂制造的云母带具有较高的导热系数；另外，该胶粘剂具有较大的相对分子质量，表现出良好的粘接性，在常温下有较高的粘度，在高温下具有较低的粘度；此外，该胶粘剂与VPI浸渍树脂之间具有很好的相容性，满足实际应用的需求。本发明高导热云母带用有机/无机复合胶粘剂的制备方法简单，原材料价格低廉。