LCP substrate-based encapsulation shell and preparation method

The present invention relates to an LCP substrate-based encapsulation shell and a preparation method. The encapsulation shell comprises a metal enclosure, a LCP substrate composite layer which is arranged below the metal enclosure, and a metal cover plate which covers the metal enclosure; a pluralit...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LYU JIPING, CHEN YIJUN, HU LIULIN, WANG DONG, QIN CHAO, BIAN LIFEI, TONG WEI, LU CHAOBAO, TANG ZHONGJUN, JIA QI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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