LCP substrate-based encapsulation shell and preparation method

The present invention relates to an LCP substrate-based encapsulation shell and a preparation method. The encapsulation shell comprises a metal enclosure, a LCP substrate composite layer which is arranged below the metal enclosure, and a metal cover plate which covers the metal enclosure; a plurality of LCP substrates which are connected with one another and are laminated so as to form the LCP substrate composite layer; the metal enclosure is in airtight connection with the LCP substrate composite layer; the metal cover plate is in airtight connection with the metal enclosure; the LCP substrate composite layer includes a chip adhesive layer, a gold wire bonding layer, components and a metal enclosure welding layer which are connected with one another sequentially; through holes are formed in the metal enclosure welding layer, so that excellent grounding and space isolation are realized; and electroplated solid holes are formed in each layer of the LCP substrate composite layer, so that electrical connection b